Integrated circuit cooling system including heat pipes and...

Details Integrated circuit cooling system including heat pipes and... Integrated circuit cooling system including heat pipes and...

2007-10-02

2007-10-02

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S704000, C361S718000, C165S080300, C165S104210, C257S713000, C174S015200

Reexamination Certificate

active

11022903

ABSTRACT:
An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.

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