Module structure having embedded chips

Details Module structure having embedded chips Module structure having embedded chips

2007-12-25

2007-12-25

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S763000, C361S792000

Reexamination Certificate

active

11273752

ABSTRACT:
A module structure having embedded chips mainly comprises a dielectric layer, at least a semiconductor chip embedded in the dielectric layer, and at least a circuit structure formed on the surface of the dielectric layer, the circuit structure electrically connected to the semiconductor chip via a plurality of conductive structures formed in the dielectric layer, for embedding the module structure in an electronic device, and electrically connecting the electronic device via the circuit structure on the surface of the dielectric layer.

REFERENCES:
patent: 5338975 (1994-08-01), Cole et al.
patent: 6787895 (2004-09-01), Jarcy et al.
patent: 2003/0133274 (2003-07-01), Chen et al.
patent: 2006/0012966 (2006-01-01), Chakravorty

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