Elevated track for support of signal lines on a printed...

Details Elevated track for support of signal lines on a printed... Elevated track for support of signal lines on a printed...

2007-11-27

2007-11-27

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

10716268

ABSTRACT:
A printed circuit board assembly utilizing an elevated track to support signal lines between components is disclosed. The track rests on a plurality of vertical supports, placed amid the components, such that the signal lines can be routed after the components are configured on the board. The vertical supports can be installed at grounding holes already present on the printed circuit board assembly. The track is sufficiently rigid to support bundles of signal lines over long spans between vertical supports. The track can be constructed of the same material as the board, to provide the same ESD and conductivity characteristics as the board, as well as ensure that the track does not contribute to the EMI signature of the board.

REFERENCES:
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patent: 6399899 (2002-06-01), Ohkawa et al.
patent: 2003/0019657 (2003-01-01), Seigerschmidt
patent: 2003/0107874 (2003-06-01), Feigenbaum et al.
patent: 2003/0180974 (2003-09-01), Akram

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