Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,...
Reexamination Certificate
2007-12-11
2007-12-11
Vu, Hien (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
C439S068000, C361S780000, C174S260000
Reexamination Certificate
active
11009640
ABSTRACT:
The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed circuit board material; at least one ground inner layer connected to ground potential; and a supply voltage inner layer connected to the potential of the supply voltage. The invention further includes at least one locally formed inner layer electrically connected to the supply voltage inner layer; a first external terminal contact serving for electrical connection to a ground terminal of an integrated circuit; and a second external terminal contact serving for electrical connection to a supply voltage terminal of an integrated circuit. In addition, a first contact-connection is provided between the first external terminal contact and the at least one ground inner layer; and a second contact-connection is provided between the second external terminal contact and the at least one locally formed inner layer. The at least one locally formed inner layer and the at least one ground inner layer provide a printed circuit board decoupling capacitor for an integrated circuit.
REFERENCES:
patent: 6991470 (2006-01-01), Muench
patent: 7149092 (2006-12-01), Iguchi
patent: 2002/0086561 (2002-07-01), Ogawa et al.
patent: 2003/0053302 (2003-03-01), Kelly et al.
patent: 2003/0063453 (2003-04-01), Kusagaya et al.
patent: 2004/0125580 (2004-07-01), Chung et al.
Festag Mario
Reznik Daniel
Finisar Corporation
Vu Hien
Workman Nydegger
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