Electrical interconnect contact system

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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H01R 909

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active

056348010

ABSTRACT:
A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus includes a housing which has a slot to receive one of each of the one or more contacts. The contact-receiving slot extends substantially parallel to an axis which extends between a corresponding lead and spaced terminal. The housing has a first trough formed therein proximate the lead and a second trough formed therein proximate the spaced terminal. A first elastomeric element is received in the first trough formed in the housing, and a second elastomeric element is received in the second trough formed in the housing. The first and second elastomeric elements have a measure of compressibility and tensile extendibility. A contact is received within each slot. Each contact provided has a protrusion which extends outward from the surface of the housing to be engaged by the lead to which it corresponds. Each contact also has a hub which extends outward from the surface to engage the corresponding spaced terminal. Each contact also has first and second hook portions, the first hook portion being disposed proximate the contact protrusion and encircling the first elastomeric element to hold the contact to the first elastomeric element, and the second hook portion being disposed proximate the contact nub and encircling the second elastomeric element to hold the contact to the second elastomeric element.

REFERENCES:
patent: 3551750 (1970-12-01), Sterling
patent: 3795037 (1974-03-01), Luttmer
patent: 4150420 (1979-04-01), Berg
patent: 4295700 (1981-10-01), Sado
patent: 4330165 (1982-05-01), Sado
patent: 4402562 (1983-09-01), Sado
patent: 4445735 (1984-05-01), Bonnefoy
patent: 4477774 (1984-10-01), Revirieux
patent: 4506938 (1985-03-01), Madden
patent: 4509099 (1985-04-01), Takamato
patent: 4511197 (1985-04-01), Grabbe et al.
patent: 4593961 (1986-06-01), Cosmo
patent: 4598246 (1986-07-01), Staples et al.
patent: 4633175 (1986-12-01), Ritchie et al.
patent: 4634199 (1987-01-01), Anhalt et al.
patent: 4664458 (1987-05-01), Worth
patent: 4686467 (1987-08-01), DeLapp et al.
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4800335 (1989-01-01), Davila et al.
patent: 4835464 (1989-05-01), Slye et al.
patent: 4866374 (1989-09-01), Cedrone
patent: 4870353 (1989-09-01), Cook
patent: 4929892 (1990-05-01), Larsen
patent: 4943768 (1990-07-01), Niki et al.
patent: 4950980 (1990-08-01), Pfaff
patent: 4998886 (1991-03-01), Werner
patent: 5069629 (1991-12-01), Johnson
patent: 5137456 (1992-08-01), Desai et al.
patent: 5139427 (1992-08-01), Boyd et al.
patent: 5207584 (1993-05-01), Johnson
patent: 5336094 (1994-08-01), Johnson
patent: 5388996 (1995-02-01), Johnson
Electronic Design, "New Methods Vie for Dense, Fast Connector Slots", Lyman, May 11, 1989, pp. 71-74.
Test & Measurement World, "Fixturing for High-Speed Test Signals", Corwith, Nov. 1990, pp. 45-48.
Surface Mount Technology, "SMT Market Trends", Stout, Nov. 1990, p. 4.
EDN, "Designs Meet Needs of High-Speed, High-Density Systems", Ormond, Jul. 5, 1990, pp. 50-58.
The Electronic System Design Magazine, "Packaging Standards: The Calm Before the Storm", Furlow, May 1989, pp. 24-26.
Connection Technology, "Testing a High-Rel Decoupling Capacitor Socket", Gallotello, Apr. 1990, pp. 39-40.
Technical Information, Decoupling: 256K DRAMS, Martin, AVX Corporation.
EMC Technology & Interference Control News, "The Role of Integrated Circuits Decoupling in Electromagnetic Campatibility", Johnston, Oct. 1983.
High Performance Decouping Capacitor for Installation Under the Dual in Line IC Package, Hyslop et al., Rogers Corporation.
Test & Measurement World, "Meeting the Electrical Challenges of IC-Handler Contractor Design", Roblee, Sep. 1989, pp. 46-50.
Electronic Packaging & Production; "Take a Look at Socketing", Hursh, Jun. 1989, pp. 56-60.
"Enhanced Performance Implanted CMOS (EPIC.TM.) Advanced CMOS Logic (ACL) Design Considerations", Weinstein et al., Texas Instruments.

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