Microstrip DC-to-GHZ field stacking balun

Details Microstrip DC-to-GHZ field stacking balun Microstrip DC-to-GHZ field stacking balun

1994-08-17

1996-06-04

Gensler, Paul

Wave transmission lines and networks

Plural channel systems

Having branched circuits

333 26, H01P 512, H01P 510

Patent

active

055237282

ABSTRACT:
A wideband (DC to GHz) PC-board Balun that is disclosed. The balun mainta low insertion loss and good balance for ultra wide band (UWB) applications such as impulse radar. The balun structure is formed by microstrip transmission lines on a dielectric substrate, having at least one inverting and one non-inverting transmission lines. The transmission lines are connected to form balanced transmission lines stacked about a ground plane. N transmission lines can be connected to form a N.sup.2 :1 impedance ratio balun. Ferrite cores placed about the transmission lines and resistor-capacitor circuits improve the low frequency operation of the balun.

REFERENCES:
patent: 5172082 (1992-12-01), Livingston et al.
patent: 5379006 (1995-01-01), McCorkle

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