Lead-free and cadmium-free conductive copper thick film pastes

Details Lead-free and cadmium-free conductive copper thick film pastes Lead-free and cadmium-free conductive copper thick film pastes

2007-02-13

2007-02-13

Group, Karl (Department: 1755)

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

C501S019000, C428S208000, C428S210000, C428S426000, C252S512000

Reexamination Certificate

active

10864304

ABSTRACT:
Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.

REFERENCES:
patent: 3615772 (1971-10-01), Kohut
patent: 4152282 (1979-05-01), Baudry et al.
patent: 4220547 (1980-09-01), Abe et al.
patent: 4323652 (1982-04-01), Baudry et al.
patent: 4379319 (1983-04-01), Wilson
patent: 4517155 (1985-05-01), Prakash et al.
patent: 4880567 (1989-11-01), Prabhu et al.
patent: 4906406 (1990-03-01), Hormadaly
patent: 5051381 (1991-09-01), Ohji et al.
patent: 5165986 (1992-11-01), Gardner et al.
patent: 5296426 (1994-03-01), Burn
patent: 5439852 (1995-08-01), Hormadaly
patent: 5468695 (1995-11-01), Carroll et al.
patent: 5491118 (1996-02-01), Hormadaly
patent: 5753571 (1998-05-01), Donohue
patent: 5948536 (1999-09-01), Suzuki et al.
patent: 6105394 (2000-08-01), Sridharan et al.
patent: 6124224 (2000-09-01), Sridharan et al.
patent: 6171987 (2001-01-01), Hormadaly
patent: 6185087 (2001-02-01), Park et al.
patent: 6673274 (2004-01-01), Venigalla et al.
patent: 6982864 (2006-01-01), Sridharan et al.
patent: 2006/0028788 (2006-02-01), Sridharan et al.

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