Heat dissipation mechanism for electronic apparatus

Details Heat dissipation mechanism for electronic apparatus Heat dissipation mechanism for electronic apparatus

2007-12-11

2007-12-11

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C174S016100, C174S016300, C165S080200, C165S080300, C165S185000

Reexamination Certificate

active

11056533

ABSTRACT:
This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.

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