Semiconductor integrated circuit device manufacturing method...

Semiconductor device manufacturing: process – Miscellaneous

Reexamination Certificate

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C438S909000, C438S758000, C206S712000, C134S001300

Reexamination Certificate

active

10932237

ABSTRACT:
A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-charge-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.

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