Surface acoustic wave element and manufacturing method thereof

Details Surface acoustic wave element and manufacturing method thereof Surface acoustic wave element and manufacturing method thereof

2007-11-27

2007-11-27

Ham, Seungsook (Department: 2817)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C310S31300R, C257S416000

Reexamination Certificate

active

11282752

ABSTRACT:
A surface acoustic wave (SAW) element including a semiconductor substrate on which a semiconductor wiring region and a SAW region are formed alongside in a same plane, a metal wiring formed in the semiconductor wiring region, an insulating layer including the metal wiring and formed throughout on surfaces of the semiconductor wiring region and the SAW region, a most upper layer of the insulating layer formed so as to have a one flat surface throughout the semiconductor wiring region and the SAW region and a uniform thickness from an upper face of the semiconductor substrate, a piezoelectric layer formed on the most upper layer of the insulating layer and an inter digital transducer (IDT) formed on the piezoelectric layer in the SAW region.

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van Zeijl et al., “FM Radio Receiver Front-End Circuitry with On-Chip SAW Filters”, IEEE Trans. on Consumer Electronics, vol. 35, No. 3, Aug. 1989, pp. 312-319.
J. H. Visser, “Surface Acoustic Wave Filters in ZnO-Sio2-Si Layerec Structures”, Ultrasonic Simposium, 1989., Proceedings, IEEE 1989, pp. 195-200. vol. 1.
Yunseong EO et al., “Reference SAW Oscillator on Quartz-on-Silicon (QoS) Wafer for PolyLithic Integration of True Single Chip Radio”, Electronic Devices Meeting, Dec. 5, 1999, IEDM Technical Digest International, pp. 761-764.
J. H. Visser et al., “On-Chip SAW Filters in Integrated Radio Systems”, Proceedings of the International Conference on Consumer Electronics (ICCE), Jun. 6, 1989, pp. 90-91.

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