Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-08-21
2007-08-21
Prasad, Chandrika (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
11193765
ABSTRACT:
An electrical connector includes a wafer having flexible members that allow the wafer to expand or contract in response to movement of solder pads on a PCB. As a PCB to which a connector is attached is heated during, for example, normal use, it may expand, which may result in the outward movement of the solder balls at the point of connection with the PCB. The flexible members in the wafer enable the wafer to likewise expand so that it does not impede the movement of the solder connections and cause a stress to be placed on the solder connections at the PCB connection point.
REFERENCES:
patent: 4072376 (1978-02-01), Shannon
patent: 4815987 (1989-03-01), Kawano et al.
patent: 4880388 (1989-11-01), Beamenderfer et al.
patent: 5330365 (1994-07-01), Leeson
patent: 5947764 (1999-09-01), Pan et al.
patent: 6033234 (2000-03-01), Wang et al.
patent: 6135791 (2000-10-01), Wang et al.
patent: 6302705 (2001-10-01), Yatskov et al.
patent: 6368116 (2002-04-01), Tabata et al.
patent: 6461202 (2002-10-01), Kline
patent: 6524115 (2003-02-01), Gates et al.
patent: 6527597 (2003-03-01), Harper, Jr.
patent: 6816385 (2004-11-01), Alcoe
patent: 6997720 (2006-02-01), Perret et al.
patent: 2002/0063318 (2002-05-01), Mitchell et al.
patent: 2003/0092293 (2003-05-01), Ohtsuki et al.
patent: 2003/0220021 (2003-11-01), Whiteman et al.
patent: 2004/0086026 (2004-05-01), Miki et al.
patent: 2005/0266741 (2005-12-01), Miyamoto et al.
FCI Americas Technology Inc.
Prasad Chandrika
Woodcock & Washburn LLP
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