Semiconductor device and electronic device, and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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C257S692000, C257S778000, C257S787000, C257SE23060

Reexamination Certificate

active

11009993

ABSTRACT:
A semiconductor device is provided including a substrate containing a wire pattern having a plurality of leads and a semiconductor chip mounted on the substrate in a manner that an electrode faces the wire pattern. The electrodes are arranged to be classified into a plurality of first groups respectively lined along a plurality of paralleling first straight lines and into a plurality of second groups respectively lined along a plurality of second straight lines extending in a direction so as to intersect with the first straight lines. Each lead includes a connecting part facing one electrode, an extension part extending along the first straight line from the connecting part, and a draw-out part that is drawn from the extension part so as to intersect with the first straight line.

REFERENCES:
patent: 5986334 (1999-11-01), Lee
patent: 6611053 (2003-08-01), Akram
patent: 6664483 (2003-12-01), Chong et al.
patent: 6782615 (2004-08-01), Shibata et al.
patent: 6853092 (2005-02-01), Ashida
patent: 04-352132 (1992-12-01), None
patent: 2000-286291 (2000-10-01), None
patent: 2000-323205 (2000-11-01), None
patent: 3537699 (2004-03-01), None
patent: 2005-93468 (2005-07-01), None

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