Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-11-27
2007-11-27
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000, C257SE21508, C257SE21509
Reexamination Certificate
active
11168549
ABSTRACT:
A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible.A substrate1has formed therein through-holes7lined on the internal walls with a wiring layer9, and solder balls6are fusion-bonded to the substrate1in such a manner as to cover the through-holes7. In the mounting process or in the repair process, heating probes41are passed through the through-holes7and thrust into the solder balls6to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls6can be heated, thereby averting adverse effects on the IC chip3. In the repair process, the solder balls6can be restored to an initial condition free of intermetallic compounds.
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Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
Zarneke David A.
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