Semiconductor wafer, semiconductor device and method of...

Details Semiconductor wafer, semiconductor device and method of... Semiconductor wafer, semiconductor device and method of...

2007-02-13

2007-02-13

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S723000, C257S759000, C257S790000, C257S791000, C438S110000, C438S113000, C438S114000, C361S803000, C361S764000, C361S765000

Reexamination Certificate

active

10679467

ABSTRACT:
A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the redistribution layer, a second resin layer which is formed over the first resin layer and covers the side surface of the first resin layer, and an external terminal which is formed to be electrically connected with the redistribution layer in a manner to avoid the pad.

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