Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Radiated energy
Reexamination Certificate
2007-10-02
2007-10-02
Gupta, Yogendra N. (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Means applying electrical or wave energy directly to work
Radiated energy
C425S121000, C425S122000, C430S322000, C700S120000
Reexamination Certificate
active
09944488
ABSTRACT:
An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing. A double platen assembly including a first platen and a second platen mutually removably connected and configured and arranged to substantially secure an electronic component assembly in position therebetween. At least one of the platens is configured such that a portion of electronic components of a carrier substrate secured by the double platen assembly is viewable for exposure to an energy beam such as a laser beam used to cure a liquid into an associated dielectric stereolithographic packaging structure. Another embodiment includes the use of an adhesive-coated film for holding, locating and securing a plurality of individual electronic components for processing. A method of forming solder balls is also disclosed.
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Gupta Yogendra N.
Luk Emmanuel S.
TraskBritt
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