Printed circuit board and interleaving routing scenario thereof

Details Printed circuit board and interleaving routing scenario thereof Printed circuit board and interleaving routing scenario thereof

2007-06-19

2007-06-19

Dinh, Tuan (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S1130AS, C174S255000, C333S033000

Reexamination Certificate

active

10957178

ABSTRACT:
A printed circuit board and a routing scenario thereof are disclosed. The printed circuit board includes three dielectric layers, two signal layers and several differential pairs. Some differential pairs are disposed in one signal layer, while some differential pairs are interleavingly disposed in the adjacent other signal layer. The differential pairs in one signal layer carries signals that flows to one direction, while the differential pairs in the adjacent signal layer carries signals that flows to an opposite direction. Under such a routing scenario, the crosstalk between differential pairs in adjacent signal layers may be reduced.

REFERENCES:
patent: 6486405 (2002-11-01), Lin
patent: 2003/0147375 (2003-08-01), Goergen et al.
patent: 2005/0099240 (2005-05-01), Lin et al.
patent: 2001-015925 (2001-01-01), None

Affiliated with

Also associated with

Rating

Printed circuit board and interleaving routing scenario thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board and interleaving routing scenario thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board and interleaving routing scenario thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3854794