Method of forming an opening or cavity in a substrate for...

Details Method of forming an opening or cavity in a substrate for... Method of forming an opening or cavity in a substrate for...

Filed on

2007-10-30

Date issued

2007-10-30

Examiner

Heinrich, Samuel M. (Department: 1725)

Patent Class

Electric heating

SubClass

Metal heating

SubSubClass

By arc

Other Related Categories

C029S835000

Type

Reexamination Certificate

Status

active

Patent number

11070558

Description

ABSTRACT:
A method of forming an opening or cavity in a substrate, for receiving an electronic component, consists of or includes providing a patterned opaque masking layer on or adjacent a first major surface of the substrate, the masking layer having an opening overlying the position where the cavity is to be made, removing material from the substrate by laser ablation through the opening thereby forming an opening or cavity of a suitable size for receiving said electronic component.

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