Integrated circuit micropackaging

Details Integrated circuit micropackaging Integrated circuit micropackaging

1979-11-20

1982-03-30

James, Andrew J.

357 59, 357 81, 357 65, H01L 2302, H01L 2504, H01L 2348

Patent

active

043227376

ABSTRACT:
Thermal dissipation problems characteristic of micropackaging applications in integrated circuits can be eliminated by the use of a semiconductor heat pipe package. Additionally, the heat pipe package as herein disclosed can be employed for the creation of substantially constant temperature surfaces. In applications where a device requires controlled temperatures in order to achieve optimum operation, such as in photo voltaic converters, the packaging of the present invention provides a means for such temperature control. The heat pipe package comprises, in its simplest form, a closed vessel or box containing a heat transferring fluid. In its liquid state, the heat transferring fluid is transported along the interior surfaces of the box by means of a plurality of microgrooves through capillary action. The interior cavity of the heat pipe package or box provides a means for transport of the heat transferring fluid in the vapor state. The integrated circuits may be disposed in the semiconductor surface of the package itself, or mounted as dies in high density. The large number of intercommunications which are required between the high density of integrated circuits included with the micropackaging can be achieved by a combination of optical and electrical communication lines or buses.

REFERENCES:
patent: 3673306 (1972-06-01), Kirkpatrick
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4200472 (1980-04-01), Chappell et al.
IBM Technical Disclosure Bulletin; Modular Organic Carrier by Arvanitakis; vol. 19, No. 9, Feb. 1977, pp. 3321-3322.
IBM Technical Disclosure Bulletin; Liquid Cooling of I-C Chips by Anacker; vol. 20, No. 9, Feb. 1978, pp. 3742-3743.

Affiliated with

Also associated with

Rating

Integrated circuit micropackaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit micropackaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit micropackaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-385108