Wafer level package for micro device

Details Wafer level package for micro device Wafer level package for micro device

2007-02-06

2007-02-06

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257SE23180

Reexamination Certificate

active

10790723

ABSTRACT:
A wafer level package includes a device wafer having a micro device, and bonding pads which are connected to the micro device, and formed at one surface of the device wafer, via connectors extending from the bonding pads to the other surface of the device wafer, external bonding pads formed at the other surface of the device wafer and connected to the bonding pads through the via connectors, and a cap structure bonded to one surface of the device wafer so as to allow the micro device to be insulated and hermetically sealed.

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German Patent Office, Office Action mailed Jun. 1, 2006 and English translation thereof.

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