Printhead integrated circuit adapted for adhesive bonding

Details Printhead integrated circuit adapted for adhesive bonding Printhead integrated circuit adapted for adhesive bonding

2007-10-30

2007-10-30

Stephens, Juanita D. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S054000

Reexamination Certificate

active

11066165

ABSTRACT:
A printhead integrated circuit suitable for bonding to a mounting surface of an ink manifold using an adhesive is provided. The printhead integrated circuit comprises: a plurality of nozzles formed on a front side of the printhead integrated circuit; a plurality of ink supply channels for supplying ink from a backside of the printhead integrated circuit to the nozzles; and a plurality of etched trenches defined in the backside. The etched trenches are configured for receiving the adhesive during bonding, thereby increasing the adhesive bond strength.

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patent: 2004/0092804 (2004-05-01), Rebec et al.
patent: 2005/0029222 (2005-02-01), Chen

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