Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2007-02-20

2007-02-20

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S112000

Reexamination Certificate

active

11392558

ABSTRACT:
A method of manufacturing a semiconductor device including a die pad section, a first semiconductor chip having a surface on which a first electrode section is formed, a second semiconductor chip having a surface on which a second electrode section is formed, a support member having a surface, lead terminal sections, and a resin encapsulating body, the method including fixing a back surface of the first semiconductor chip and the surface of the support member to the die pad section; fixing a back surface of the second semiconductor chip to the surface of the first semiconductor chip and the surface of the support member; electrically connecting the first and second electrode sections respectively to the lead terminal sections; and sealing the die pad section, the first and second semiconductor chips and the support member with a resin.

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