Positive tone bi-layer imprint lithography method

Details Positive tone bi-layer imprint lithography method Positive tone bi-layer imprint lithography method

2007-02-20

2007-02-20

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

Mechanically forming pattern into a resist

C216S039000, C216S041000, C216S047000, C216S052000, C216S057000, C216S072000, C216S079000, C264S220000, C264S425000, C156S242000, C156S247000, C156S272800, C156S289000

Reexamination Certificate

active

10396615

ABSTRACT:
The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.

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