Method and apparatus for forming an electrical contact with...

Details Method and apparatus for forming an electrical contact with... Method and apparatus for forming an electrical contact with...

2007-12-18

2007-12-18

Wilkins, III, Harry D (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S280000, C205S147000

Reexamination Certificate

active

11259694

ABSTRACT:
The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stored in a reservoir and pump through an inlet channel to the liquid chamber. The liquid conductor is injected into a liquid chamber such that the liquid conductor makes contact with the outer surface of the workpiece. An inflatable tube is also provided to prevent the liquid conductor from reaching the back face of the workpiece. A plating solution can be applied to the front face of the workpiece where a retaining ring/seal further prevents the plating solution and the liquid conductor from making contact with each other. In an alternative embodiment, electrical contacts may be formed using an inflatable tube that has either been coated with a conductive material or contains a conductive object. The inflatable tube further provides uniform contact and pressure along the periphery of the workpiece, which may not necessarily be perfectly flat, because the tube can conform according to the shape of the periphery of the workpiece. Further, the present invention can be used to dissolve/etch a metal layer from the periphery of the workpiece.

REFERENCES:
patent: 4269686 (1981-05-01), Newman et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5447615 (1995-09-01), Ishida
patent: 5567300 (1996-10-01), Datta et al.
patent: 5779492 (1998-07-01), Okuyama et al.
patent: 5833820 (1998-11-01), Dubin et al.
patent: 5862605 (1999-01-01), Horie et al.
patent: 5871626 (1999-02-01), Crafts et al.
patent: 6033540 (2000-03-01), Kosaki et al.
patent: 6056869 (2000-05-01), Uzoh
patent: 6099702 (2000-08-01), Reid et al.
patent: 6132586 (2000-10-01), Adams et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6197182 (2001-03-01), Kaufman et al.
patent: 6251235 (2001-06-01), Talieh et al.
patent: 6402925 (2002-06-01), Talieh
patent: 6440295 (2002-08-01), Wang
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6506103 (2003-01-01), Ohmori et al.
patent: 6534116 (2003-03-01), Basol
patent: 6600229 (2003-07-01), Mukherjee et al.
patent: 6610190 (2003-08-01), Basol et al.
patent: 6653226 (2003-11-01), Reid
patent: 6676822 (2004-01-01), Talieh
patent: 6848970 (2005-02-01), Manens et al.
patent: 6902659 (2005-06-01), Talieh
patent: 6942780 (2005-09-01), Basol et al.
patent: 6958114 (2005-10-01), Talieh et al.
patent: 2002/0074238 (2002-06-01), Mayer et al.
patent: 2003/0054729 (2003-03-01), Lee et al.
patent: 2003/0223764 (2003-12-01), Moore et al.
patent: 2763343 (1998-11-01), None
patent: 1350070 (1974-04-01), None
patent: 6-108285 (1994-04-01), None
patent: 11-054479 (1999-02-01), None
patent: WO 97/01657 (1997-01-01), None

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