Ion implantation apparatus

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S441110

Reexamination Certificate

active

11235663

ABSTRACT:
An ion implantation apparatus structure is provided that does not allow gas to accumulate in the vicinity of a wafer when implantation ions to the wafer. The ion implantation apparatus includes a rotating body that rotates in a fixed direction, a vacuum chamber that houses the rotating body, and an ion beam injecting portion that injects an ion beam to a wafer placed on the rotating body. The rotating body comprises one or more wafer placement boards having a wafer placement face on one face, a driving portion that drives the wafer placement board, and a gas evacuation member provided protruding from one face of the wafer placement board having a gas evacuation wall face on the front in the direction of rotation, and functions such that due to rotation of the wafer placement board, the gas evacuation wall face collides with gas present on one face of the wafer placement board and the gas is evacuated upward or to the rear face of the wafer placement face.

REFERENCES:
patent: 4680474 (1987-07-01), Turner et al.
patent: 4743767 (1988-05-01), Plumb et al.
patent: 5971701 (1999-10-01), Kawamura et al.
patent: 2005/0092938 (2005-05-01), Garza et al.
patent: 11-204075 (1999-07-01), None
Patent Abstracts of Japan, vol. 017, No. 608 (E-1457), Nov. 9, 1993 & JP 05 190133 A (NEC Corp), Jul. 30, 1993.
Patent Abstracts of Japan, vol. 010, No. 255 (E-433) Sep. 2, 1986 & JP 61 081621 A (NEC Corp), Apr. 25, 1986.
International Search Report mailed Jul. 24, 2006 in corresponding EP appln. No. 05256025.7-2208.

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