Device having a complaint element pressed between substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Reexamination Certificate

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Details

C257S780000, C257S785000, C439S066000, C439S081000, C439S110000

Reexamination Certificate

active

10723095

ABSTRACT:
A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.

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