Semiconductor device with a plurality of semiconductor...

Details Semiconductor device with a plurality of semiconductor... Semiconductor device with a plurality of semiconductor...

2007-06-12

2007-06-12

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Specified wide band gap semiconductor material other than...

C257S077000, C257SE27001

Reexamination Certificate

active

10494613

ABSTRACT:
A semiconductor module comprises independently operable segments1(semiconductor elements) on a SiC substrate. Each segment1comprises a source electrode pad2and a gate electrode pad3both provided to the principal surface side of the SiC substrate, and a drain electrode pad provided on the back surface side of the SiC substrate. The semiconductor module further comprises an isolation region such as a trench or a Schottky diode for electrically isolating the adjacent segments1from each other. Only electrode pads2and3of each of the segments1determined as conforming items by a test are connected to electrode terminals41and43, respectively.

REFERENCES:
patent: 6514779 (2003-02-01), Ryu et al.
patent: 48-101888 (1973-12-01), None
patent: 08-195411 (1996-07-01), None
patent: 2001-53275 (2001-02-01), None
patent: 2002-110727 (2002-04-01), None

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