Fabrication method and structure of PCB assembly, and tool...

Details Fabrication method and structure of PCB assembly, and tool... Fabrication method and structure of PCB assembly, and tool...

2007-12-11

2007-12-11

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

11100005

ABSTRACT:
A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1and electrically connects to the first pad. The second solder joints respectively have a maximum width J2exceeding J1and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

REFERENCES:
patent: 6157079 (2000-12-01), Taguchi
patent: 6569752 (2003-05-01), Homma et al.
patent: 2002/0068381 (2002-06-01), Ference et al.

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