Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-08-14
2007-08-14
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S601000, C029S832000, C156S256000, C438S108000, C438S125000
Reexamination Certificate
active
11124593
ABSTRACT:
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.
REFERENCES:
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5566441 (1996-10-01), Marsh et al.
patent: 6147662 (2000-11-01), Grabau et al.
patent: 6358437 (2002-03-01), Jonas et al.
patent: 6437985 (2002-08-01), Blanc et al.
patent: 6957481 (2005-10-01), Patrice
patent: 197 31 969 (1998-08-01), None
patent: 197 57 542 (1999-06-01), None
patent: 298 24 033 (2000-05-01), None
patent: 199 55 120 (2001-05-01), None
patent: 0 083 046 (1983-07-01), None
patent: 1 162 480 (2001-12-01), None
Halik Marcus
Klauk Hagen
Schmid Günter
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
Trinh Minh
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