Structure for cooling a surface

Details Structure for cooling a surface Structure for cooling a surface

2007-10-30

2007-10-30

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S720000, C257S721000, C257SE23102, C257SE23103

Reexamination Certificate

active

11037670

ABSTRACT:
An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

REFERENCES:
patent: 5375655 (1994-12-01), Lee
patent: 6084895 (2000-07-01), Kouchi et al.
patent: 6301109 (2001-10-01), Chu et al.
patent: 6453987 (2002-09-01), Cheng
patent: 2004/0087116 (2004-05-01), Nakayama
Hukseflux, Thermal Conductivity Science, 1999.

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