Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2007-10-02
2007-10-02
Lewis, Monica (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S784000, C257S787000, C257S734000, C257S737000, C257S738000
Reexamination Certificate
active
10123827
ABSTRACT:
Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.
REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5748450 (1998-05-01), Kim et al.
patent: 5811317 (1998-09-01), Maheshwari et al.
patent: 5898224 (1999-04-01), Akram
patent: RE36325 (1999-10-01), Corbett et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6121576 (2000-09-01), Hembree et al.
patent: 6127724 (2000-10-01), DiStefano
patent: 6160715 (2000-12-01), Degani et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6198162 (2001-03-01), Corisis
patent: 6208156 (2001-03-01), Hembree
patent: 6214716 (2001-04-01), Akram
patent: 6222265 (2001-04-01), Akram et al.
patent: 6225702 (2001-05-01), Nakamura
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6329637 (2001-12-01), Hembree et al.
patent: 6391762 (2002-05-01), Gamota et al.
patent: 6400574 (2002-06-01), Stephenson et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6500764 (2002-12-01), Pritchett
patent: 6503781 (2003-01-01), Stephenson et al.
patent: 6504389 (2003-01-01), Hembree et al.
patent: 6507114 (2003-01-01), Hui et al.
patent: 6522018 (2003-02-01), Tay et al.
patent: 6533159 (2003-03-01), Cobbley et al.
patent: 6559537 (2003-05-01), Bolken et al.
patent: 6576495 (2003-06-01), Jiang et al.
patent: 6576496 (2003-06-01), Bolken et al.
patent: 6577004 (2003-06-01), Rumsey et al.
patent: 6583502 (2003-06-01), Lee et al.
patent: 6595408 (2003-07-01), Cobbley et al.
patent: 6599822 (2003-07-01), Akram
patent: 6600335 (2003-07-01), Tay et al.
patent: 6602733 (2003-08-01), Iwahashi et al.
patent: 6603071 (2003-08-01), Takao
patent: 6638792 (2003-10-01), Hui et al.
patent: 6646286 (2003-11-01), Akram
patent: 6660558 (2003-12-01), Boken et al.
patent: 6661103 (2003-12-01), Akram
patent: 6661104 (2003-12-01), Jiang et al.
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6687989 (2004-02-01), Farnworth et al.
patent: 6700183 (2004-03-01), Jiang
patent: 6724084 (2004-04-01), Hitika et al.
patent: 6736306 (2004-05-01), Byun et al.
patent: 6750552 (2004-06-01), Narayanan
patent: 6762495 (2004-07-01), Reyes et al.
patent: 6778404 (2004-08-01), Bolken et al.
patent: 6781245 (2004-08-01), Huang
patent: 6825569 (2004-11-01), Jiang et al.
patent: 6889430 (2005-05-01), Jiang et al.
patent: 2002/0100976 (2002-08-01), Hui et al.
patent: 2002/0114135 (2002-08-01), Akram et al.
patent: 2002/0149298 (2002-10-01), Furukawa et al.
patent: 2002/0167077 (2002-11-01), Vincent
patent: 2002/0187590 (2002-12-01), Bolken et al.
patent: 2002/0195718 (2002-12-01), Imasu et al.
patent: 2003/0027377 (2003-02-01), Owens
patent: 2003/0116866 (2003-06-01), Cher'Khng et al.
patent: 2003/0193088 (2003-10-01), Hall et al.
patent: 2004/0004292 (2004-01-01), Hsieh et al.
patent: 2004/0084771 (2004-05-01), Bolken et al.
patent: 2004/0164412 (2004-08-01), Bolken et al.
patent: 2004/0200885 (2004-10-01), Derderian
patent: 2004/0212067 (2004-10-01), Wang
patent: 2005/0019983 (2005-01-01), Bolken et al.
patent: 2345191 (1999-12-01), None
patent: 2345191 (2000-06-01), None
patent: 409232375 (1997-09-01), None
patent: 2003-234435 (2003-08-01), None
patent: 2001027290 (1999-09-01), None
patent: 10-2001-0027290 (2001-04-01), None
patent: 20010027290 (2001-04-01), None
Fan et al., Incorporation of Inorganic Filler into the No-Flow Underfill Material for Flip-Chip Application, 2000, International Symposium on Advanced Packaging Materials, pp. 303-310.
Baerlocher Cary J.
Hall Frank L.
Lewis Monica
Schwegman Lundberg Woessner & Kluth P.A.
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