Micro probe 2

Details Micro probe 2 Micro probe 2

2007-06-05

2007-06-05

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11208285

ABSTRACT:
Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods.

REFERENCES:
patent: 4918383 (1990-04-01), Huff et al.
patent: 4980637 (1990-12-01), Huff et al.
patent: 5914613 (1999-06-01), Gleason et al.
patent: 6507207 (2003-01-01), Nguyen

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