Integrated packaged having magnetic components

Details Integrated packaged having magnetic components Integrated packaged having magnetic components

2007-12-11

2007-12-11

Toledo, Fernando L. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S678000, C257S684000, C257S690000, C257S693000, C257S723000

Reexamination Certificate

active

11329934

ABSTRACT:
A packaged device is obtained using an innovative package approach that allows integration of miniature planar magnetics into standard low-cost semiconductor packages (BGA, PDIP, SOIC, etc.) with electronic and electrical components, where those components can be C&W and/or SMD types. The packaged device includes a planar magnetic substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon. A magnetic component is provided in the substrate. A package material provided at least partly around the substrate and the magnetic component to protect the substrate and magnetic component. The magnetic component is an inductor or transformer. The packaged device further includes at least one semiconductor component provided on the first dielectric layer.

REFERENCES:
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5835367 (1998-11-01), Pan et al.
patent: 6797891 (2004-09-01), Blair et al.
patent: 7135728 (2006-11-01), Duan et al.
patent: 2003/0042571 (2003-03-01), Chen et al.
patent: 2007/0121364 (2007-05-01), Bertin et al.

Affiliated with

Also associated with

Rating

Integrated packaged having magnetic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated packaged having magnetic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated packaged having magnetic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3841071