Semiconductor device with electrode pads for test probe

Details Semiconductor device with electrode pads for test probe Semiconductor device with electrode pads for test probe

2007-10-16

2007-10-16

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S758010, C324S763010

Reexamination Certificate

active

11094673

ABSTRACT:
A semiconductor device includes a plurality of I/O regions provided in a peripheral region of the semiconductor device. Each of the plurality of I/O regions includes an electrode pad. The electrode pad has a test probe area and a bonding area which are separately provided, and a test probe is made to contact the test probe area and an external electrode is connected to the bonding area. The semiconductor device may have a multi-layer wiring structure, and the electrode pad connected to the multi-layer wiring structure. An uppermost wiring layer of the multi-layer wiring structure may be arranged in a region other than a region directly under the test probe area.

REFERENCES:
patent: 5554940 (1996-09-01), Hubacher
patent: 5900643 (1999-05-01), Preslar et al.
patent: 6008061 (1999-12-01), Kasai
patent: 6429532 (2002-08-01), Han et al.
patent: 6937047 (2005-08-01), Tran et al.
patent: 2002-329742 (2002-11-01), None

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