Method of manufacturing a magnetic head with common seed...

Details Method of manufacturing a magnetic head with common seed... Method of manufacturing a magnetic head with common seed...

2007-06-12

2007-06-12

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603250, C029S603120, C029S603130, C360S123090, C360S125330, C205S205000, C205S119000, C427S129000, C427S304000

Reexamination Certificate

active

10976370

ABSTRACT:
A method for fabricating a coil and pedestal for a write head using a common seed layer is described. A nonmetallic gap layer is deposited on a planarized pole piece surface. Openings for the pole piece pedestal and the back gap pole piece are etched through the nonmetallic gap layer. A seed layer comprising a magnetic material is deposited on the etched gap layer. Preferably the coil is fabricated first on the planar surface of the seed layer. The coil structure, the pedestal pole piece, back-gap pole piece, side and center tap connections are fabricated on the same seed layer. The remaining seed layer is removed, the coil is encapsulated, the wafer is refilled with alumina and the wafer is planarized. The prior art process can be resumed at this point. Optionally a second seed layer such as copper (Cu) can be used.

REFERENCES:
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patent: 6578252 (2003-06-01), Sasaki
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patent: 2002/0191351 (2002-12-01), Santini
patent: 2003/0174435 (2003-09-01), Edward et al.
patent: 2004/0066576 (2004-04-01), Lee et al.
patent: 2-10508 (1990-01-01), None
Williams, E. M., “Monte Carlo Simulation of Thin Film Head Read-Write Performance”, IEEE Transactions on Magnetics, vol. 26, No. 6, Nov. 1990, pp. 3022-3026.

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