Semiconductor device using metal nitride as insulating film

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S761000, C257SE23145

Reexamination Certificate

active

11362872

ABSTRACT:
A first insulating film is formed on a semiconductor substrate. A second insulating film made of insulating metal nitride is formed on the first insulating film. A recess is formed through the second insulating film and reaches a position deeper than an upper surface of the first insulating film. A conductive member is buried in the recess. A semiconductor device is provided whose interlayer insulating film can be worked easily even if it is made to have a low dielectric constant.

REFERENCES:
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patent: 6291891 (2001-09-01), Higashi et al.
patent: 6605874 (2003-08-01), Leu et al.
patent: 6750541 (2004-06-01), Ohtsuka et al.
patent: 2004/0026364 (2004-02-01), Kihara et al.
patent: 09-246375 (1997-09-01), None
patent: 2001-230219 (2001-08-01), None
patent: 2002-124568 (2002-04-01), None
patent: 2003-17496 (2003-01-01), None
Japanese Office Action dated Oct. 31, 2006 (mailing date), issued in corresponding Japanese Patent Application No. 2002-133055.

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