Packaged semiconductor device

Details Packaged semiconductor device Packaged semiconductor device

2007-02-27

2007-02-27

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000

Reexamination Certificate

active

10682921

ABSTRACT:
A packaged semiconductor device has an integrated chip and a non-integrated chip. The integrated chip has an integrated circuit and first bump pads formed with a narrow pitch. The non-integrated chip has second bump pads formed so as to face the first bump pads, lead pads formed with a wide pitch (so as to permit connection thereto of wires), and wiring conductors electrically connecting these pads together. The two chips are connected together by way of bumps and are then sealed in resin. With this structure, it is possible to realize a low-cost packaged semiconductor device that can easily be mounted on a mother board.

REFERENCES:
patent: 6057598 (2000-05-01), Payne et al.
patent: 6239366 (2001-05-01), Hsuan et al.
patent: 6420787 (2002-07-01), Kobayashi et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6734556 (2004-05-01), Shibata
patent: 6781247 (2004-08-01), Shibata
patent: 05-226420 (1993-09-01), None
patent: 07-321162 (1995-12-01), None
patent: 10-270498 (1998-10-01), None
patent: 11-186324 (1999-07-01), None
patent: 2000-012733 (2000-01-01), None
patent: 2000-223652 (2000-08-01), None
patent: 2001-217371 (2001-08-01), None

Affiliated with

Also associated with

Rating

Packaged semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3835642