Stacked land grid array package

Details Stacked land grid array package Stacked land grid array package

2007-06-05

2007-06-05

Owens, Douglas W. (Department: 2821)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C361S600000, C361S679090, C361S689000

Reexamination Certificate

active

11270296

ABSTRACT:
A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack tolerance and forceful bias to hold the stack tightly together.

REFERENCES:
patent: 4185176 (1980-01-01), Matsuo
patent: 5717177 (1998-02-01), Tsai et al.
patent: 5765820 (1998-06-01), Marusiak
patent: 5943210 (1999-08-01), Lee et al.

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