Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-08-14
2007-08-14
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S707000, C257S712000, C257SE23101
Reexamination Certificate
active
11164971
ABSTRACT:
A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. The circuit substrate has an opening, which exposes a portion of the bonding surface. The locating structures are disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely. The chip is disposed on the bonding surface exposed by the opening, and the wires are coupled between the chip and the circuit substrate. The encapsulating compound is disposed on the bonding surface exposed by the opening for covering the chip, the wires, and a portion of the circuit substrate. The chip package has high reliability and high yield of processing.
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Huang Cheng-Wei
Yao Kuang-Wei
Advanced Semiconductor Engineering Inc.
Chu Chris C.
Parker Kenneth
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