Method of forming metal layers formed as a composite of sub-laye

Details Method of forming metal layers formed as a composite of sub-laye Method of forming metal layers formed as a composite of sub-laye

1994-12-05

1996-06-04

Fourson, George

Fishing, trapping, and vermin destroying

437192, 437194, 437246, H01L 2128

Patent

active

055232590

ABSTRACT:
In an integrated circuit, an opening (e.g., via or window) is filled with an Al-based plug which has essentially a <111> orientation and comprises at most three grains. These characteristics are achieved by first depositing a texture control Ti layer having substantially a (002) basal plane orientation followed by at least three Al-based sublayers. The grain sizes and deposition conditions are controlled in such a way that during deposition of the third sublayer, the microstructure of the plug adjusts itself to produce a single grain (or at most three).

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