Vapor cooled semiconductor device having an improved structure a

Details Vapor cooled semiconductor device having an improved structure a Vapor cooled semiconductor device having an improved structure a

1975-01-30

1976-12-07

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 79, 357 81, 165 80, 165105, 317100, 174 16HS, H01L 2504, H01L 2342, H01L 2344, H01L 2346

Patent

active

039966046

ABSTRACT:
A vapor cooled semiconductor device which comprises an envelope having at least one aperture, at least one semiconductor element enclosed therein, an electrode contacting the semiconductor element and exposed across the aperture of the envelope, an expandable diaphragm disposed through an insulator between the electrode and the wall of the envelope to seal the gap therebetween, spherical spring plates disposed outside the envelope and arranged to support the semiconductor element through the electrode under pressure, and a liquid coolant enclosed in the closed envelope, with space provided therein, whereby the semiconductor element may be cooled by the latent heat of vaporization of the liquid coolant.

REFERENCES:
patent: 2886746 (1959-05-01), Saby
patent: 2958021 (1960-10-01), Cornelison
patent: 3654528 (1972-04-01), Barkan
patent: 3736474 (1973-05-01), Sias
patent: 3800190 (1974-03-01), Marek
IBM Technical Disclosure Bulletin, Micro-Electronic Package; by Bleher et al.; vol. 12, No. 5, Oct. 1969.

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