Method for forming a resist pattern of magnetic device

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S603120, C029S603130, C029S603140, C029S603180, C029S603230, C360S324000, C216S022000

Reexamination Certificate

active

10773234

ABSTRACT:
A pattern forming method includes forming a resist pattern for lift off of a first film disposed on a surface side of a base, patterning the first film by dry etching using the resist pattern as a mask, depositing a second film after patterning, removing the resist pattern to remove a portion of the second film on the resist pattern, and etching the surface side of the base after removing the resist pattern. The etching includes dry-etching the surface side of the base using etching particles with a main incident angle of the etching particles to the surface side of the base being set in a range of 60° to 90° relative to a normal direction of the one surface of the base. The dry etching is performed while rotating the base about an axis substantially parallel with the normal direction.

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patent: A-2002-363730 (2002-12-01), None

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