Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Reexamination Certificate
2007-05-29
2007-05-29
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
C228S004500, C228S264000
Reexamination Certificate
active
10820852
ABSTRACT:
A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a chuck table, a semiconductor chip take-out area and an electrode cutting area, a cutting mechanism having a cutting tool for cutting the plurality of electrodes projecting from the front surface of the semiconductor chip held on the chuck table and arranged in the electrode cutting area to make them uniform in height, a semiconductor chip take-in mechanism, and a semiconductor chip conveying mechanism.
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Arai Kazuhisa
Mori Takashi
Namioka Shinichi
Sandoh Hideyuki
Disco Corporation
Edmondson Lynne R.
Smith , Gambrell & Russell, LLP
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