Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-02-13
2007-02-13
Richards, N. Drew (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257SE27088
Reexamination Certificate
active
11154922
ABSTRACT:
A semiconductor memory device comprises a cell capacitor having a first buried contact connected with a semiconductor substrate of a cell region and a first storage node connected with the first buried contact, and a decoupling capacitor for reducing a coupling noise, having a plurality of second buried contacts formed on a semiconductor substrate portion adjacent in the cell region and extended in parallel with each other and a plurality of second storage nodes connected with the second buried contacts.
REFERENCES:
patent: 6888716 (2005-05-01), List et al.
patent: 2001/0014040 (2001-08-01), Ooishi
patent: 09-283718 (1997-10-01), None
patent: 2000-150824 (2000-05-01), None
patent: 2000-252437 (2000-09-01), None
patent: 10-2004-0059437 (2004-07-01), None
Patent Abstracts of Japan for Publication No. 09-283718.
Patent Abstracts of Japan for Publication No. 2000-150824.
Patent Abstracts of Japan for Publication No. 2000-252437.
Korean Intellectual Property Office Korean Patent Abstracts for Publication No. 10-2004-0059437.
Hwang Yoo-Sang
Park Je-Min
F.Chau & Associates LLC
Karimy Mohammad Timor
Richards N. Drew
LandOfFree
Semiconductor memory device having a decoupling capacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor memory device having a decoupling capacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor memory device having a decoupling capacitor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3823367