Lay-up system

Details Lay-up system Lay-up system

1990-09-12

1992-08-25

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156264, 156266, 156267, 1563041, 156516, 156517, 144346, 144348, B32B 3118

Patent

active

051415828

ABSTRACT:
A method of producing panels from boards wherein a subassembly of boards is prepared on a conveyor and crowded against indexing pins. The trailing board in this subassembly is then cut lengthwise by a saw, to produce a panel assembly of predetermined width. Adhesive is then applied between contiguous edges of the boards in the panel assembly, and the boards then consolidated into an integral panel.

REFERENCES:
patent: 2323105 (1943-06-01), Welch
patent: 3003541 (1961-10-01), Prentice et al.
patent: 3135644 (1964-06-01), Coplen et al.
patent: 4314871 (1982-02-01), Weinstock et al.

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