Method for manufacturing electro-optical device,...

Details Method for manufacturing electro-optical device,... Method for manufacturing electro-optical device,...

2007-02-27

2007-02-27

Norton, Napine (Department: 1765)

Etching a substrate: processes

Forming or treating optical article

C216S023000, C216S025000, C216S026000

Reexamination Certificate

active

10732198

ABSTRACT:
A method is provided for manufacturing an electro-optical device, in which fine scratches or cracks can be removed by etching without damaging wiring, an electro-optical device, and an electronic apparatus. According to the method, a liquid crystal panel used in an electro-optical device is cut as a single product. Then, before an IC mounting step, in a state of the single product liquid crystal panel, a wet etching is performed on the cut faces and edges of the first and second substrates to remove fine scratches or cracks from the cut faces and edges of the substrates. At this time, wiring portions, IC mounting terminals, substrate mounting terminals, and alignment marks, which are formed on the protruding region, are covered with a protection layer.

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Communication from Japanese Patent Office re: counterpart application, no date.
Communication from Chinese Patent Office re: related application, no date.
Communication from Korean Patent Office regarding related application, no date.

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