Designing a plated pattern in printed writing board

Details Designing a plated pattern in printed writing board Designing a plated pattern in printed writing board

2007-06-05

2007-06-05

Talbot, Brian K. (Department: 1762)

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

C427S010000, C427S096100

Reexamination Certificate

active

10261939

ABSTRACT:
The plating method comprises the steps of dividing a region, to be plated, into a group of mesh-like zones, measuring a plating area of each of the zones, comparing the measurement values of the plating areas and judging whether or not the plating area has any variance, and conducting a design change, on patterns contained in this zone, to eliminate the variance.

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Japanese Office Action for corresponding Japanese Application No. 2002-025491 dated Jun. 7, 2005.

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