Semiconductor memory device with MOS transistors, each...

Static information storage and retrieval – Floating gate

Reexamination Certificate

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C365S185170, C365S189011, C365S230060

Reexamination Certificate

active

11087831

ABSTRACT:
A semiconductor memory device includes memory cells, a memory cell array, word lines, latch circuits, first row decoders, second row decoders, first isolating transistors, and second isolating transistors. The memory cell includes a memory cell transistor having a floating gate and a control gate. The memory cell array includes the memory cells arranged in a matrix. The word line connects in common the control gates of the memory cell transistors in a same row. The first row decoder applies a positive voltage to the word lines in a write operation and in an erase operation. The second row decoder applies a negative voltage to the word lines in a write operation and in an erase operation. The first isolating transistor switches between the first row decoder and the word line. The second isolating transistor switches between the second row decoder and the word line.

REFERENCES:
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patent: 2005/0111288 (2005-05-01), Shibata et al.
patent: 2001-93288 (2001-04-01), None
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Wei-Hua Liu, et al. “A 2-Transistor Source-select (2TS) Flash EEPROM for 1.8V-Only Applications”, Non-Volatile Semiconductor Memory Workshop 4.1, 1997, pp. 1-3.
Ken Takeuchi, et al. “A Negative Vth Cell Architecture for Highly Scalable, Excellently Noise Immune and Highly Reliable NAND Flash Memories”, 1998 Symposium on VLSI Circuits Digest of Technical Papers, pp. 234-235.
Do Dormans, et al. “High-Density Low-Voltage Byte-Erasable EEPROM Memory Based on a 2T-FNFN Flash Cell”; IEEE NVSMW 2003; Feb. 17, 2003; pp. 21-22.
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