Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S666000, C257S684000, C257S690000, C257S692000, C257S731000, C257S733000, C257S748000, C257S773000, C257S781000, C257S784000

Reexamination Certificate

active

10861487

ABSTRACT:
A semiconductor device includes a base, a semiconductor element having a plurality of electrodes, a plurality of conductive lines connected to the electrodes of the semiconductor element, plating stubs attached to the conductive lines, and a plurality of wiring layers formed in a plurality of layers on the base. The plating stub attached to a first conductive line, and the plating stubs attached to one or a plurality of second conductive lines adjacent to the first conductive line, exist in different conductive wiring layers.

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patent: 6608375 (2003-08-01), Terui et al.
patent: 6800944 (2004-10-01), Buschbom
patent: 2002/0017730 (2002-02-01), Tahara et al.
patent: 2002/0149086 (2002-10-01), Aoki
patent: 2003/0111738 (2003-06-01), Buschbom
patent: 2004/0092136 (2004-05-01), Farnworth et al.
patent: 6-112354 (1994-04-01), None
patent: 06-204357 (1994-07-01), None
patent: 06-334065 (1994-12-01), None
patent: 09-199627 (1997-07-01), None

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