Bipolar transistor with a very narrow emitter feature

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure

Reexamination Certificate

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C257SE29030

Reexamination Certificate

active

10978775

ABSTRACT:
A double-polysilicon, self-aligned bipolar transistor has a collector region formed in a doped semiconductor substrate, an intrinsic counterdoped base formed on the surface of the substrate and a doped intrinsic emitter formed in the surface of the intrinsic base. An etch stop insulator layer overlies the intrinsic base layer above the collector. A base contact layer of a conductive material overlies the etch stop dielectric layer and the intrinsic base layer. A dielectric layer overlies the base contact layer. A wide window extends through the insulator layer and the base contact layer down to the insulator layer. An island or a peninsula is formed in the wide window leaving at least one narrowed window within the wide window, with sidewall spacers in either the wide window or the narrowed window. The narrowed windows are filled with doped polysilicon forming an extrinsic emitter with the intrinsic emitter formed below the extrinsic emitter in the surface of the intrinsic base.

REFERENCES:
patent: 5866462 (1999-02-01), Tsai et al.
patent: 6380017 (2002-04-01), Darwish et al.
patent: 6440810 (2002-08-01), Johansson et al.
patent: 6475848 (2002-11-01), Darwish et al.
Greg Freeman et al., “SiGe HBT Performance and Reliability Trends through ftof 350 GHz”, Proc. IEEE Reliability Physics Symposium (Mar. 30, 2003).
Mathia Rickelt et al., “Influence of Impact-Ionization Induced Instabilities on the Maximum Usable Output Voltage of Si-Bipolar Transistors”, IEEE Trans. on Electron Devices vol. 48 n.4 p. 774-783 (Apr. 2001).

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