Method for manufacturing a probe card

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S832000, C029S842000, C029S846000, C029S854000, C029S874000, C216S013000, C174S250000, C174S260000, C174S261000, C324S754090, C324S755090, C324S757020, C324S758010, C324S761010, C361S822000, C439S055000

Reexamination Certificate

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10771876

ABSTRACT:
A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surface of a second sacrificial substrate, a signal transmission line formation step of forming a signal transmission line in the base substrate, a first contact joining step of attaching the first surface of the first sacrificial substrate to the base substrate and joining the first contact to the signal transmission line, and a second contact joining step of attaching the first surface of the second sacrificial substrate to the base substrate and joining the second contact to the signal transmission line.

REFERENCES:
patent: 5166774 (1992-11-01), Banerji et al.
patent: 5434453 (1995-07-01), Yamamoto et al.
patent: 5510758 (1996-04-01), Fujita et al.
patent: 02054985 (1990-02-01), None
patent: 6-241781 (1994-09-01), None
patent: 11-230707 (1999-08-01), None
Patent Abstracts of Japan, Publication No. 11-230707 dated Aug. 27, 1999, 1 pg.
Patent Abstracts of Japan, Publication No. 06-241781 dated Sep. 2, 1994, 1 pg.
International Search Report issued in PCT/JP02/08049 mailed on Nov. 26, 2002, 2 pgs.

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